Telecom Implementation:

    a. Installation of Base Transceiver Station (BTS) system Indoor & Outdoor

        (Micro-Cell & Pico- Cell):

  • Site Survey, Installation all BTS and Microwave equipment
  • Top-building and In-door Antenna, In-building power, coaxial and fiber optic Cable installation, Installation, testing and commissioning

    b. Indoor Building Coverage / IBC / DAS

To make cellular customer comfortable and no signal dropped when they still in the basement area or non coverage area in the building, Cellular operator to deliver high quality wireless communication systems for IBC. The best solution for this situation is develop IBC by using in building wireless communication systems.

 MW Transmission Services

    a. Line of Sight / LOS Survey

The results LOS Survey is make sure the possibility of MW Link Implementation for two sites (PtP/point to point). The data consist of:

  • Site location lay out drawing
  • Coordinate of sites, Altitude of sites
  • Blocking object (Height of trees, Building, towers, etc) with azimuth Degree
  • Terrain condition along the path (Water, sea, Dessert, etc)
  • Picture of path, picture of blocking objects
  • Installation Design Survey
  • Path Profile Analysis
  • Path Calculation / Link Budget Analysis

This is the LOS (Line of Site) activities compiling and creating the reports. Our professional and experiences engineers will create the report and compiling the data’s for one LOS Report

b. MW Installation Design Survey:

The activities for MW design survey are to find and make sure the space available for MW equipment’s,

  1. MW Path Profile Analysis:
  • By using the Pathloss, it could be plotting the site coordinates taken from GPS coordinate data’s for   the two sites, and could be fixing the MW location either height or direction
  • Making reports, which all the report will be showing in Pathloss software drawing sheet, including coordinate, azimuth, altitude, latitude, path distance

Installation & SWAP – IPRAN

Installation FMR.DBS Project

In-Bond & Out-Bond Materials